NCHU Global Research & Industry Alliance

  • patent name / The Synthetic Technology of Stable Cu Nanoparticles (CuNP) with High Catalytic Activity
  • inventor / Wei-Ping Dow
  • Patent number / I633957、I626989、I394620

For electroless Cu deposition, Sn/Pd is the only catalyst for 4-5 decade until the CuNP is successful, meaning that the CuNP can replace the Sn/Pd as the catalyst for electroless Cu deposition. CuNP can greatly reduce the process cost of advanced IC substrate fabrication. In addition, the IC substrate with fine conductive lines can be carried out. The technology has been transferred to a Japanese company. It will be commercialized in next year.

Electroless Copper Deposition, Cu Nanoparticles(CuNP), Catalyst, Catalytic Activity, Printed Circuit Boards(PCBs), IC Substrate.