A method for manufacturing a copper foil with single crystalline copper nodules in one plating bath was achieded. In the plating tank, an electrolyte solution flows between an anode and a cathode with a current density of 5 ASF - 40 ASF. The rough surface of the copper foil has dense copper nodules that are single crystals. The electrolyte solution contains chloride ions, suppressor, accelerator, sulfuric acid and copper sulphate.

Three-dimensional Copper Foil, Single Crystalline Copper Nodules, Electroplating